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- 电子元器件
- 电阻
- 电容器
- 电感
- 保险丝
- 二极管
- 三极管
- 接插件
- 蜂鸣器
- MOS
- 集成电器基础知识
- 接地的基础知识
- STA
- Skew
- setup和hold
- 问题
- timing path
- Latency
- 跨时钟域的代码检查(spyglass)
- 时间换算
- 名词解释
- 寄存器
- 触发器
- ECO
- 通用芯片和嵌入式芯片有什么区别
- Signoff
- SOC
- VLSI
- NPU
- DDR
- ISP
- Fan-in 和 Fan-out
- 逻辑阈值
- Floorplan
- 寄存器传输的设计(RTL)
- 集成电路设计方法
- Design Rules of Thumb
- Dealing with Resistance
- 芯片设计
- 什么是Scenario?
- 晶圆BUMP加工工艺和原理
- wafer、die、cell
- DFT
- 前端-QC
- CDC
- SDC
- MBIST
- RDC
- Lint
- overview
- PV
- PBA/GPA
- Corner
- PVT
- latency与delay区别
- Power
- LVT, RVT, HVT 的区别
- PPA
- RTL
- 芯片行业的IP是指什么?
- 晶振与晶体的区别
- PLL (锁相环(PhaseLockedLoop))
- 奇偶分频电路
- inverter
- glitch (电子脉冲)
- Power
- Clock Gating
- 低功耗设计
- UPF
- 低功耗单元库
- Power intent
- 亚稳态
- 芯片流程
- 芯片软件
- 亚稳态&MTBF&同步器&AFIFO
- glitch free的时钟切换技术
- max_transition
- MUX
- STA之RC Corner
- process corner 和 PVT
- ICC Scenario Definition
- 寄生电路?
- 晶振
- 信号完整性
- 什么是脉冲?什么是电平?
- 阈值电压
- bump
- IC设计常用文件及格式介绍
- 文件格式
- spef
- 后端
- phy芯片的作用
- MIPI简介
- 异步桥
- 芯片后仿之SDF
- 慕课-VLSI设计基础(数字集成电路设计基础)
- 概论
- MOS晶体管原理
- 设计与工艺接口
- 反相器和组合逻辑电路
- 问题trainning